Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-Layer Backplane Board

Abstract

Signal via transition is inevitable in backplane multi-layer board for high density routing. And a significant simultaneous switching noise (SSN) coupling to a signal occurs through the signal via transition. In this paper, we present suppression method of the SSN noise coupling caused by via transition in multi-layer backplane board using electromagnetic bandgap (EBG) structure. EBG structures are vertically located around a signal via to provide the low power/ground impedance area. The low power/ground impedance area suppresses the noise propagation and reduces the SSN noise coupling. It is shown that, within the stopband, the power/ground impedance at the position of the signal via with EBG structures is free from the power/ground planes cavity resonance, and the SSN coupling in single-ended and differential signaling is suppressed.

Meeting Name

20th International Zurich Symposium on Electromagnetic Compatibility (2009: Jan. 12-16, Zurich, Switzerland)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Periodic structures; Electromagnetic interference; Backplanes; Metamaterials; Impedance; Noise reduction; Routing; Electromagnetic coupling; Electromagnetic propagation; Resonance

International Standard Book Number (ISBN)

978-3-9523286-4-4

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2009 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

16 Jan 2009

Link to Full Text

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