Mode Matching Analysis of Via-Plate Capacitance in Multilayer Structures with Finite Plate Thickness
In this paper, an analytical method for evaluation of via-plate capacitance including finite plate thickness in multilayer structures is proposed. An electrostatic boundary-value problem associated with a via in parallel plates is solved based on the Hankel transform and mode matching method, and thereby a fast-converging series-form expression for the via-plate capacitance is derived. The effect of finite plate thickness is taken into account by adopting the mode matching method instead of imposing an artificial perfect magnetic conductor boundary as in the previous works. We perform some computations to show the behaviors of the capacitance in terms of the via geometry, and they are validated through comparison with a static/quasi-static simulation, full-wave electromagnetic simulation, and the previous analytical solutions of via capacitance.
H. Park et al., "Mode Matching Analysis of Via-Plate Capacitance in Multilayer Structures with Finite Plate Thickness," IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 5, pp. 1188 - 1196, Institute of Electrical and Electronics Engineers (IEEE), Oct 2015.
The definitive version is available at https://doi.org/10.1109/TEMC.2015.2440299
Electrical and Computer Engineering
Keywords and Phrases
Hankel Transform; Mode Matching Method; Multilayer Structures; Via-Plate Capacitance
International Standard Serial Number (ISSN)
Article - Journal
© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Oct 2015