An Efficient Method to Extract Surface-Wave Poles of Green's Functions near Branch Cut in Lossy Layered Media
Abstract
Calculating the Green's functions in lossy layered media using the discrete complex image method (DCIM) is challenging, due to the difficulties in extracting the surface-wave poles that are very close to a branch cut. An efficient algorithm based on the contour method is proposed in this communication to locate these poles and calculate the residues. The proposed method is robust for both the lossless and lossy media. With the proposed approach, it is shown in numerical examples that some poles, very close to a branch cut, are successfully extracted in lossy media. The accurate calculation of the Green's functions in lossy layered media enables the accurate and efficient modeling of complex structures in lossy semiconductor substrates and new 3D IC structures including through-silicon vias (TSVs).
Recommended Citation
S. Pan and J. Fan, "An Efficient Method to Extract Surface-Wave Poles of Green's Functions near Branch Cut in Lossy Layered Media," IEEE Transactions on Antennas and Propagation, vol. 63, no. 1, pp. 439 - 442, Institute of Electrical and Electronics Engineers (IEEE), Jan 2015.
The definitive version is available at https://doi.org/10.1109/TAP.2014.2367545
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Algorithms; Electronics packaging; Green's function; Image processing; Integrated circuit interconnects; Poles; Semiconducting silicon; Surface waves; Discrete complex image method; Layered media; Pole extraction; Sommerfeld integrals; Spectral domains; Surface wave poles; Three dimensional integrated circuits; lossy layered media
International Standard Serial Number (ISSN)
0018-926X
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 2015