The Development of an EM-Field Probing System for Manual Near-Field Scanning

Author

Hui He
Pratik Maheshwari
David Pommerenke, Missouri University of Science and TechnologyFollow

Abstract

This research was conducted to visualize the frequency-dependent electromagnetic field distribution for electromagnetic compatibility (EMC) applications and the time evolution of the current flow induced by an electrostatic discharge (ESD) on complex-shaped electronic systems. These objectives were achieved by combining magnetic field probing with a system that automatically records the probe's position and orientation. The local magnetic field associated with the probe location was recorded and displayed at near real time on the captured 3-D geometry. Consequently, a field strength map was obtained for EMC applications. Also, a video showing the spreading of the ESD-induced current with subnanosecond resolution was captured for ESD applications after the ESD-induced surface current density associated with the probe location was recorded.

Recommended Citation

H. He et al., "The Development of an EM-Field Probing System for Manual Near-Field Scanning," IEEE Transactions on Electromagnetic Compatibility, vol. 58, no. 2, pp. 356 - 363, Institute of Electrical and Electronics Engineers (IEEE), Apr 2016.

The definitive version is available at https://doi.org/10.1109/TEMC.2015.2496376

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Electric discharges; Electromagnetic compatibility; Electromagnetic fields; Electrostatic discharge; Magnetic fields; Probes; Electromagnetic field distribution; Electronic systems; Frequency dependent; Local magnetic field; Near-field scanning; Position and orientations; Sub nanoseconds; Surface current density; Electrostatic devices; electromagnetic interference (EMI) scan; manual scan

International Standard Serial Number (ISSN)

0018-9375

Document Type

Article - Journal

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Apr 2016