High-Speed Serial Link Challenges using Multi-Level Signaling
Abstract
The paper discusses challenges of high-speed serial links using multi-level signaling and gives comparison of the performance of the various channels with different lossy materials and equalization options. Advantages and problems of multi-level signaling are shown based on the test results.
Recommended Citation
N. Dikhaminjia et al., "High-Speed Serial Link Challenges using Multi-Level Signaling," Proceedings of the 24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015, San Jose, CA), pp. 57 - 60, Institute of Electrical and Electronics Engineers (IEEE), Dec 2015.
The definitive version is available at https://doi.org/10.1109/EPEPS.2015.7347129
Meeting Name
24th IEEE Conference on Electrical Performance of Electronic Packaging and Systems (2015: Oct. 25-28, San Jose, CA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Jitter; equalization; High speed serial links; Lossy materials; Multi-level signaling; PAM4; Various Channels; Electronics packaging; NRZ
International Standard Book Number (ISBN)
978-1479936410
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2015 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Dec 2015
