Design Methodology for Behavioral Surface Roughness Model
Abstract
The surface roughness of copper foils has a considerable impact on the signal integrity performance of transmission lines at high data rates and long propagation distances. Existing surface roughness models for low-loss transmission lines are inadequate for accurate characterization. A new behavioral model for analyzing the surface roughness effects has been developed. The model is applied in the design process by adding a dispersive term to the bulk dielectric to represent the loss due to the foil surface roughness. By adding a broadband dielectric model into the original transmission model, time- and frequency-domain performance improvements are achieved.
Recommended Citation
X. Guo et al., "Design Methodology for Behavioral Surface Roughness Model," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada), pp. 927 - 931, Institute of Electrical and Electronics Engineers (IEEE), Jul 2016.
The definitive version is available at https://doi.org/10.1109/ISEMC.2016.7571775
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Sponsor(s)
National Science Foundation (U.S.)
Keywords and Phrases
Design; Electric Lines; Electromagnetic Compatibility; Frequency Domain Analysis; Permittivity; Scattering Parameters; Dielectric Modeling; Dielectric Permittivities; Impure Response; Low Loss Transmission Lines; Propagation Distances; Surface Roughness Effects; Surface Roughness Model; Time And Frequency Domains; Surface Roughness; Conductor Surface Roughness; Dielectric Permittivity; Impure Response; S-Parameter
International Standard Book Number (ISBN)
978-1509014415; 978-1509014422
International Standard Serial Number (ISSN)
2158-1118
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2016
Comments
This paper is based upon work supported partially by the National Science Foundation under Grant No. IIP-1440110.