Analytical Equivalent Circuit Modeling for Multiple Core Vias in a High-Speed Package
Abstract
Core vias found in the packages of high-speed ICs can have a large impact on overall channel performance. Thus accurately modeling core vias in the package is essential. In this paper analytical methodologies are used to calculate equivalent circuit models of core vias.
Recommended Citation
S. Jim et al., "Analytical Equivalent Circuit Modeling for Multiple Core Vias in a High-Speed Package," Proceedings of the 2016 IEEE International Symposium on Electromagnetic Compatibility (2016, Ottawa, Canada), Institute of Electrical and Electronics Engineers (IEEE), Jul 2016.
The definitive version is available at https://doi.org/10.1109/ISEMC.2016.7571650
Meeting Name
2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Equivalent Circuit; Modeling; Core Via; Package; Analytical
International Standard Serial Number (ISSN)
2158-1118
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jul 2016
