PCB Ground Fill Design Guidelines for Radiated EMI
Abstract
This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.
Recommended Citation
W. Pan et al., "PCB Ground Fill Design Guidelines for Radiated EMI," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility 2008 (2008, Detroit, MI), Institute of Electrical and Electronics Engineers (IEEE), Aug 2008.
The definitive version is available at https://doi.org/10.1109/ISEMC.2008.4652141
Meeting Name
2008 IEEE International Symposium on Electromagnetic Compatibility, EMC 2008 (2008: Aug. 18-22, Detroit, MI)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
EMI; PCB; Design Guideline; Ground Fill; Printed Circuit Board; Printed circuits
Document Type
Article - Conference proceedings
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
22 Aug 2008
