Validating the Transmission-Line Based Material Property Extraction Procedure Including Surface Roughness for Multilayer PCBs using Simulations

Abstract

Accurate frequency-dependent dielectric properties are important for accurate modeling of signal and power integrity problems. One method for extracting dielectric properties from fabricated multilayer printed circuit boards is based on the measured electrical property of fabricated transmission lines, denoted the 'Root-omega' method. In this paper, the 'Root-omega' method applied to the cases with smooth and rough conductors is validated using simulations. Potential errors in the procedure are discussed.

Meeting Name

2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Second Research Center/Lab

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Dielectric properties; Electric lines; Electromagnetic compatibility; Multilayers; Printed circuit boards; Sensitivity analysis; Surface roughness; Accurate modeling; Frequency dependent; Multi-layer pcbs; Multilayer printed circuit board; Potential errors; Power integrity; procedure validation; Property extractions; Extraction; conductor roughness; electrical property of transmission line; material property extraction

International Standard Book Number (ISBN)

978-1-5090-1441-5

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2016

Link to Full Text

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