Top-Layer Inductance Extraction for the Pre-Layout Power Integrity using the Physics-Based Model Size Reduction (PMSR) Method

Abstract

Proper power integrity analysis is required for printed circuit board (PCB) power distribution network (PDN) design. Developing a simple physics-based equivalent circuit model for critical structures is essential for understanding the physics of the system and for intelligent designs. In this paper, a physics-based model size reduction (PMSR) method is applied to get the equivalent circuit model for the above-ground geometries. The extracted physics-based models are also based on PEEC, and can be used in analyzing the structure in its parts. By applying PMSR method, a physics-based equivalent circuit model can be proposed and this circuit model is related to the geometric features of the design. In this way, PMSR method can provide an intuitive guideline in designing PCB and reducing above inductances, therefore, a low-ripple DC voltage can be delivered through PDN. Taking advantage of PEEC and PMSR methods, the top-layer inductances of three different geometries (the shared via design, the doublet design and the shared pad design) are calculated and the physics-based circuit models are obtained, respectively.

Meeting Name

2016 IEEE International Symposium on Electromagnetic Compatibility (2016: Jul. 25-29, Ottawa, Canada)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Second Research Center/Lab

Electromagnetic Compatibility (EMC) Laboratory

Keywords and Phrases

Circuit simulation; Circuit theory; Electromagnetic compatibility; Equivalent circuits; Geometry; Inductance; Printed circuit boards; Printed circuit design; Reconfigurable hardware; Size determination; Equivalent circuit model; Inductance extraction; PEEC; Physics-based circuit models; Physics-based modeling; Power distribution network; Printed circuit boards (PCB); Top layers; Electric network analysis

International Standard Book Number (ISBN)

978-1-5090-1441-5

International Standard Serial Number (ISSN)

1077-4076

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jul 2016

Link to Full Text

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