Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board
Abstract
A methodology for modeling the power delivery network from the voltage regulator module to the pins of a high pin count integrated circuit on a printed circuit board (PCB) is presented. The proposed model is based on inductance extraction from first principle formulation of a cavity formed by parallel metal planes. Circuit reduction is used to practically realize the model for a production level, complex, multilayer PCBs. The lumped element model is compatible with SPICE-type simulators. The resulting model has a relatively simple circuit topology. The model is corroborated with microprobing measurements up to a few gigahertz. The model can be used for a wide range of geometry variations in a power integrity analysis, including complex power/ground stack up, various numbers of decoupling capacitors with arbitrary locations, numerous IC power pins and IC power/ground return via layouts, as well as hundreds of ground return vias.
Recommended Citation
K. Shringarpure et al., "Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board," IEEE Transactions on Electromagnetic Compatibility, vol. 58, no. 3, pp. 849 - 858, Institute of Electrical and Electronics Engineers (IEEE), Jun 2016.
The definitive version is available at https://doi.org/10.1109/TEMC.2016.2535459
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Complex networks; Electric network analysis; Electric power transmission; Printed circuits; Reconfigurable hardware; Topology; Voltage regulators; Decoupling capacitor; Inductance extraction; Lumped element model; Multi-layered printed circuit boards; Power delivery network; Power distribution network; Printed circuit boards (PCB); Voltage regulator module; Printed circuit boards; Modeling PCB PDN; power integrity
International Standard Serial Number (ISSN)
0018-9375
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jun 2016
