Abstract
Formation of the biorecognition layers within microfluidic sensor channels must be done after the completion of the channel structure since these layers cannot withstand the wafer bonding temperature. We propose a new post-bonding immobilization process to prepare the enzyme layers within microfluidic channels of electrochemical biosensors. An array of Pt vertical electrodes is electroplated using a SU-8 mold. The cured SU-8 is then removed by plasma etching to expose the Pt electrode and to define the fluidic channel cavity simultaneously. An array of enzyme posts is formed on the Pt surface by either electropolymerizing or photopolymerizing enzyme precursor solutions injected into the channel. Very little report is available about the reactive ion etching (RIE) of SU-8 that is the most critical step in this process. A systematic investigation on the RIE of SU-8 is conducted to obtain the maximum etch rate (1.2 ¿m/min.) based on different combinations of parameters of CF4 and O2 gas flow, RF power and time.
Recommended Citation
M. G. Perez et al., "Process Development for the Formation of Post-Bonding Biorecognition Layers in Microfluidic Biosensors," Proceedings of the 5th IEEE Conference on Sensors, 2006, Institute of Electrical and Electronics Engineers (IEEE), Jan 2007.
The definitive version is available at https://doi.org/10.1109/ICSENS.2007.355548
Meeting Name
5th IEEE Conference on Sensors, 2006
Department(s)
Electrical and Computer Engineering
Second Department
Chemical and Biochemical Engineering
Third Department
Materials Science and Engineering
Sponsor(s)
National Science Foundation (U.S.)
University of Missouri--Rolla. Intelligent Systems Center
Keywords and Phrases
Biorecognition Layers; Enzyme Layers; Microfluidic Sensor Channels; Biosensors
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2007 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 2007
Included in
Biology Commons, Electrical and Computer Engineering Commons, Materials Science and Engineering Commons