Abstract
Numerical and experimental results of a microwave noncontact, nondestructive detection and evaluation of disbonds and thickness variations in stratified composite media are presented. The aperture admittance characteristics of a flange mounted rectangular waveguide radiating into a layered, generally lossy dielectric media backed or unbacked by a conducting sheet is modeled. The theoretical implementation is based on a Fourier transform boundary matching technique to construct the field components in each medium, coupled with a stationary form of the terminating aperture admittance of the waveguide. The model can serve as a reliable test bed for real-time examination of layered composite media. Experimental results for several cases are presented which show good agreement with the theoretical findings. This is a versatile technique for near-field in situ interrogation of stratified composite media which provides for high resolution measurements.
Recommended Citation
S. Bakhtiari et al., "Microwave Noncontact Examination of Disbond and Thickness Variation in Stratified Composite Media," IEEE Transactions on Microwave Theory and Techniques, vol. 42, no. 3, pp. 389 - 395, Institute of Electrical and Electronics Engineers (IEEE), Mar 1994.
The definitive version is available at https://doi.org/10.1109/22.277431
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Composite Materials; Dielectric Materials; Directional Patterns (Antenna); Electric Impedance; Electric Network Analysis; Fourier Transforms; In Situ Processing; Microwave Measurement; Microwaves; Nondestructive Examination; Thickness Measurement; Variational Techniques; Aperture Admittance; Disbond; Fourier Transform Boundary Matching Technique; Microwave Noncontact Examination; Stratified Composite Media; Thickness Variations; Rectangular Waveguides
International Standard Serial Number (ISSN)
0018-9480
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 1994 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Mar 1994