Abstract
EMI can often be reduced by selectively filtering various parts of a given system. One common method employed by designers is to split the groundplane near the chassis and route I/O lines over the split. The rationale is based on providing a large series impedance to common-mode currents on the I/O lines. In this manner, PCB designers hope to lower the level of noise currents contributing to radiation. This work studies the efficacy of the groundplane split as a deterrent for EMI associated with I/O lines being driven against other extended reference structures. A test-board was developed to analyze the impedance of the groundplane split with various configurations.
Recommended Citation
D. M. Hockanson et al., "Investigation of Split Groundplanes at the Connector for EMI Control," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1997, Austin, TX), pp. 177 - 182, Institute of Electrical and Electronics Engineers (IEEE), Aug 1997.
The definitive version is available at https://doi.org/10.1109/ISEMC.1997.667564
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (1997: Aug. 18-22, Austin, TX)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
EMI Control; I/O Lines Routing; PCB Designers; Common-Mode; Connector; Electric Connectors; Electric Impedance; Electromagnetic Compatibility; Electromagnetic Interference; Extended Reference Structures; Groundplane Split Efficiency; Noise Currents Reduction; Printed Circuit Design; Printed Circuit Testing; Selective Filtering; Series Impedance; Split Groundplanes; Test-Board; Electric Connectors; Electric Currents; Electric Grounding; Printed Circuit Boards; Electromagnetic Wave Interference
International Standard Book Number (ISBN)
780341406
International Standard Serial Number (ISSN)
0190-1494
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 1997 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 1997