Abstract
Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Near-field magnetic scanning is an effective tool for measuring the current distribution in IC packages and investigating chiplevel EMI problems. This paper discusses analysis of near-magnetic field scan data using tangential and normal field measurements. Results show that combining near-field scan results from probes with multiple orientations is an effective way to identify the current paths in IC packages.
Recommended Citation
X. Dong et al., "Determination of High Frequency Package Currents from Near-Field Scan Data," Proceedings of the 2005 International Symposium on Electromagnetic Compatibility (2005, Chicago, IL), vol. 3, pp. 679 - 683, Institute of Electrical and Electronics Engineers (IEEE), Aug 2005.
The definitive version is available at https://doi.org/10.1109/ISEMC.2005.1513610
Meeting Name
2005 International Symposium on Electromagnetic Compatibility, EMC 2005 (2005: Aug. 8-12, Chicago, IL)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
EMI; IC; Near-field Magnetic Scanning; VLSI
International Standard Book Number (ISBN)
0-7803-9380-5
International Standard Serial Number (ISSN)
2158-110X
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 2005
