Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Well designed ICs maintain good control of the currents that they generate. However, poorly designed ICs can drive high-frequency noise currents onto nominally low-frequency input and output pins. These currents can excite unintentional radiating structures on the printed circuit board, resulting in radiated emissions that are difficult or expensive to control. The paper discusses the use of magnetic near-field scanning techniques to measure the current distribution in IC packages. This technique is applied to common ICs, including a clock driver, a memory module and a field programmable gate array (FPGA). Results show that near-field magnetic scanning is an effective tool for investigating chip-level EMI problems.
X. Dong et al., "Analysis of Chip-Level EMI using Near-Field Magnetic Scanning," Proceedings of the 2004 International Symposium on Electromagnetic Compatibility (2004, Santa Clara, CA), Institute of Electrical and Electronics Engineers (IEEE), Jan 2004.
The definitive version is available at https://doi.org/10.1109/ISEMC.2004.1350020
2004 InternationalSymposium on Electromagnetic Compatibility, EMC 2004 (2004: Aug. 9-13, Silicon Valley, CA)
Electrical and Computer Engineering
Keywords and Phrases
FPGA; IC Packages; Chip-Level EMI Analysis; Clock Driver; Current Distribution; Electric Current Measurement; Electric Noise Measurement; Electromagnetic Compatibility; Electromagnetic Interference; Field Programmable Gate Array; High-Frequency Noise Currents; Integrated Circuit Noise; Integrated Circuit Testing; Integrated Circuits; Magnetic Field Measurement; Memory Module; Near-Field Magnetic Scanning; Printed Circuit Board; Radiated Emissions; Radiated Energy; Unintentional Radiating Structures
International Standard Book Number (ISBN)
Article - Conference proceedings
© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
01 Jan 2004