Abstract
The use of combined embedded modulated scattering technique and near-field microwave nondestructive testing techniques is investigated as a novel method for evaluating the dielectric properties of a material. The forward formulation for determining the reflection coefficient at the aperture of a waveguide radiating into a dielectric half-space in which a PIN diode-loaded dipole (i.e., modulated scattering technique probe) is embedded was presented in Part I of this paper. Here, in Part II, the recalculation of the dielectric properties, using the results of the forward model, is presented along with some associated experimental results.
Recommended Citation
R. Zoughi and D. Hughes, "A Novel Method for Determination of Dielectric Properties of Materials using a Combined Embedded Modulated Scattering and Near-Field Microwave Techniques-Part II: Dielectric Property Recalculation," IEEE Transactions on Instrumentation and Measurement, vol. 54, no. 6, pp. 2398 - 2401, Institute of Electrical and Electronics Engineers (IEEE), Dec 2005.
The definitive version is available at https://doi.org/10.1109/TIM.2005.858133
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
Dielectric Material Characterization; PIN Diode-Loaded Dipole; Dielectric Half-Space; Dielectric Material Property; Dielectric Materials; Dielectric Measurement; Dielectric Properties; Dielectric Property Recalculation; Electromagnetic Wave Reflection; Electromagnetic Wave Scattering; Embedded Modulated Scattering; Embedded Sensors; Forward Formulation; Forward Model; Microwave Measurement; Microwave Nondestructive Testing; Modulated Scattering Technique; Near-Field Microwave Nondestructive Testing; Nondestructive Testing; Reflection Coefficient; Waveguide Aperture; Electromagnetic Formulation-Probe Development And Antennas; Material Characterization
International Standard Serial Number (ISSN)
0018-9456
Document Type
Article - Journal
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Dec 2005