Abstract
Increases in the speed and density of electronic systems do not necessarily result in tougher electromagnetic compatibility problems. In fact, recent advances in packaging technology can help designers to meet electromagnetic compatibility requirements. However, working with new technologies requires us to re-evaluate existing EMC design models and guidelines. Understanding the system-level impact of component-level packaging changes, is a prerequisite for meeting stringent electromagnetic compatibility requirements in a timely and cost-effective manner.
Recommended Citation
T. H. Hubing, "The Role of Component Packaging in System Electromagnetic Compatibility," Proceedings of the IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging, 1994, Institute of Electrical and Electronics Engineers (IEEE), Jan 1994.
The definitive version is available at https://doi.org/10.1109/EPEP.1994.594068
Meeting Name
IEEE 3rd Topical Meeting on Electrical Performance of Electronic Packaging, 1994
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
EMC Design Models; Component Packaging; Electromagnetic Compatibility; Electronic Systems; Packaging
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 1994 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Jan 1994
