Abstract
A non-orthogonal time-domain full-wave solver, is developed based on the Discrete Surface Integral (DSI) technique. Closed form expressions are derived for the coefficients used in the leap-frog computation scheme so that the DSI technique can be implemented as a generalized finite-difference procedure. This procedure is employed to investigate the propagation characteristics of a typical interconnect via in printed circuits. The numerically calculated scattering parameters show consistent behavior with measured results. A square via with equal area is also evaluated.
Recommended Citation
H. Shi and J. L. Drewniak, "Study of Interconnect Vias by the Discrete Surface Integral Method," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (1995, Atlanta, GA), pp. 228 - 233, Institute of Electrical and Electronics Engineers (IEEE), Aug 1995.
The definitive version is available at https://doi.org/10.1109/ISEMC.1995.523552
Meeting Name
IEEE International Symposium on Electromagnetic Compatibility (1995: Aug. 14-18, Atlanta, GA)
Department(s)
Electrical and Computer Engineering
Research Center/Lab(s)
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
S-Parameters; Closed Form Expressions; Coefficients; Discrete Surface Integral; Discrete Surface Integral Method; Finite Difference Time-Domain Analysis; Finite-Difference Procedure; Integral Equations; Interconnect Vias; Measured Results; Nonorthogonal Time-Domain Full-Wave Solver; Printed Circuits; Propagation Characteristics; Scattering Parameters; Square Via
International Standard Book Number (ISBN)
0780325737; 0780336089
International Standard Serial Number (ISSN)
0190-1494
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 1995 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 Aug 1995
