New EMC Design Guidelines for Multilayer Printed Wiring Boards

Author

Todd H. Hubing, Missouri University of Science and TechnologyFollow
Thomas Van Doren, Missouri University of Science and TechnologyFollow

Recommended Citation

T. H. Hubing and T. Van Doren, "New EMC Design Guidelines for Multilayer Printed Wiring Boards," Proceedings of the Electrical Performance of Electronic Packaging, 1992, Institute of Electrical and Electronics Engineers (IEEE), Jan 1992.

The definitive version is available at https://doi.org/10.1109/EPEP.1992.572280

Meeting Name

Electrical Performance of Electronic Packaging, 1992

Department(s)

Electrical and Computer Engineering

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 1992 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jan 1992