Abstract
A method to extract a lumped element prototype SPICE model is used to study noise coupling between non-parallel traces on a PCB. The parameters in this model are extracted using a PEEC-like approach, a Circuit Extraction approach based on a Mixed-Potential Integral Equation formulation (CEMPIE). Without large numbers of unknowns, the SPICE model saves computation time. Also, it is easy to incorporate into system SPICE net list to acquire the system simulation result considering the coupling between traces on the printed circuit board (PCB). A representative case is studied, and the comparison of measurements, CEMPIE simulation, and SPICE modeling are given.
Recommended Citation
S. Luan and J. Fan and W. Liu and F. Xiao and J. L. Knighten and N. W. Smith and R. Alexander and J. Nadolny and Y. Kami and J. L. Drewniak, "Extracting CAD Models for Quantifying Noise Coupling Between Vias in PCB Layouts," Proceedings of the 52nd IEEE Electronic Components and Technology Conference (2002, San Diego, CA), pp. 343 - 346, Institute of Electrical and Electronics Engineers (IEEE), May 2002.
The definitive version is available at https://doi.org/10.1109/ECTC.2002.1008118
Meeting Name
52nd IEEE Electronic Components and Technology Conference (2002: May 28-31, San Diego, CA)
Department(s)
Electrical and Computer Engineering
Keywords and Phrases
CAD Model; CEMPIE Simulation; PCB Layout; PEEC; SPICE; Circuit Extraction; Circuit Layout CAD; Circuit Noise; Equivalent Circuits; Integral Equations; Lumped Element SPICE Model; Mixed-Potential Integral Equation; Noise Coupling; Nonparallel Traces; Parameter Extraction; Printed Circuit Layout; Via; Computer Aided Design; Computer Simulation; Electric Lines; Mathematical Models; Matrix Algebra; Spurious Signal Noise; Quantifying Noise; Printed Circuit Boards
International Standard Book Number (ISBN)
780374304
International Standard Serial Number (ISSN)
0569-5503
Document Type
Article - Conference proceedings
Document Version
Final Version
File Type
text
Language(s)
English
Rights
© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
Publication Date
01 May 2002
