Evaluation of Polyimide as a Dielectric for Multichip Packaging
Bachman, B., Pryde, C. A., Johnson, E. T., Simoff, D. A., & Robinson, M. B. (1989). Evaluation of Polyimide as a Dielectric for Multichip Packaging. Proceedings of the International Symposium on Microelectronics (1989, Baltimore, MD), p.462. International Union of Pure and Applied Chemistry.
International Symposium on Microelectronics, ISHM ’89 (1989: Oct. 24-26, Baltimore, MD)
Article - Conference proceedings
© 1989 International Union of Pure and Applied Chemistry, All rights reserved.
26 Oct 1989