Title

Evaluation of Polyimide as a Dielectric for Multichip Packaging

Meeting Name

International Symposium on Microelectronics, ISHM ’89 (1989: Oct. 24-26, Baltimore, MD)

Department(s)

Economics

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 1989 International Union of Pure and Applied Chemistry, All rights reserved.

Publication Date

26 Oct 1989

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