Evaluation of Polyimide as a Dielectric for Multichip Packaging

Author

Bonnie Bachman, Missouri University of Science and TechnologyFollow
C. A. Pryde
E. T. Johnson
D. A. Simoff
M. B. Robinson

Recommended Citation

Bachman, B., Pryde, C. A., Johnson, E. T., Simoff, D. A., & Robinson, M. B. (1989). Evaluation of Polyimide as a Dielectric for Multichip Packaging. Proceedings of the International Symposium on Microelectronics (1989, Baltimore, MD), p.462. International Union of Pure and Applied Chemistry.

Meeting Name

International Symposium on Microelectronics, ISHM ’89 (1989: Oct. 24-26, Baltimore, MD)

Department(s)

Economics

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 1989 International Union of Pure and Applied Chemistry, All rights reserved.

Publication Date

26 Oct 1989