Ion Bombardment of Polyimide Films
Surfaces of polyimide films have been bombarded with argon ions under controlled conditions and characterized by X-ray photoelectron spectroscopy (XPS). It was found that ion bombardment diminishes the carbonyl functionality of the film and that the initial chemical-shifted arene component in the main C1s transition decreases in intensity with increasing ion dose. XPS data also indicate that carbon bonding changes with increased ion doses or ion energies.
Bachman, B., & Vasile, M. J. (1988). Ion Bombardment of Polyimide Films. Proceedings of the 38th IEEE Electronic Components Conference (1988, Los Angeles, CA), pp. 444 Institute of Electrical and Electronics Engineers (IEEE).
The definitive version is available at https://doi.org/10.1109/ECC.1988.12630
38th IEEE Electronic Components Conference (1988: May 9-11, Los Angeles, CA)
Keywords and Phrases
Polyimides; Adhesives; Chemicals; Bonding; Argon; Polymer films; Rough surfaces; Surface roughness; Surface contamination; Spectroscopy
Article - Conference proceedings
© 1988 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.
11 May 1988