Ion Bombardment of Polyimide Films

Author

Bonnie Bachman, Missouri University of Science and TechnologyFollow
M. J. Vasile

Abstract

Surfaces of polyimide films have been bombarded with argon ions under controlled conditions and characterized by X-ray photoelectron spectroscopy (XPS). It was found that ion bombardment diminishes the carbonyl functionality of the film and that the initial chemical-shifted arene component in the main C1s transition decreases in intensity with increasing ion dose. XPS data also indicate that carbon bonding changes with increased ion doses or ion energies.

Recommended Citation

Bachman, B., & Vasile, M. J. (1988). Ion Bombardment of Polyimide Films. Proceedings of the 38th IEEE Electronic Components Conference (1988, Los Angeles, CA), p.444. Institute of Electrical and Electronics Engineers (IEEE).

The definitive version is available at https://doi.org/10.1109/ECC.1988.12630

Meeting Name

38th IEEE Electronic Components Conference (1988: May 9-11, Los Angeles, CA)

Department(s)

Economics

Keywords and Phrases

Polyimides; Adhesives; Chemicals; Bonding; Argon; Polymer films; Rough surfaces; Surface roughness; Surface contamination; Spectroscopy

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 1988 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

11 May 1988