Doctoral Dissertations

Abstract

"With the demand for developing high-capacity, high-density, high-power optical links for data center communications, co-packaged optics is a promising solution. When the three-dimensional (3D) IC and optic engines are integrated into the same package, the design of such systems in terms of signal integrity, power integrity, and electromagnetic interference will be more challenging.

This first paper mainly focuses on modeling the bias-voltage-dependent, temperature-dependent, and light-intensity-dependent hysteresis behavior of a through-silicon-vias (TSV) structure in 3D IC and analyzing its effect on the power integrity of a system with 3D IC.

This second paper investigates the scaled tendency of the emissions in a router system loaded with hundreds of optical modules, which can be applied for both traditional and future router systems with co-packaged optics. An artificial router mimicking the real system was built to investigate this tendency. Theoretical analysis, a statistical prediction method, and measurement have predicted and verified that the average of the maximal electric field radiated will increase following a 10 log10 N (dB) tendency, where N is the number of optical modules"--Abstract, p. iv

Advisor(s)

Kim, DongHyun (Bill)

Committee Member(s)

Hwang, Chulsoon
Beetner, Daryl G.
Khilkevich, Victor
Fan, Jun, 1971-
Fisher, Daniel

Department(s)

Electrical and Computer Engineering

Degree Name

Ph. D. in Electrical Engineering

Publisher

Missouri University of Science and Technology

Publication Date

Fall 2022

Pagination

xi, 72 pages

Note about bibliography

Includes_bibliographical_references_(pages 67-71)

Rights

© 2022 Wei Zhang, All Rights Reserved

Document Type

Dissertation - Open Access

File Type

text

Language

English

Thesis Number

T 12325

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