Doctoral Dissertations
Keywords and Phrases
Electrostatic Discharge; SEED; Soft Failure
Abstract
"This research proposal presents a methodology whereby an integrated circuit (IC) can be characterized with respect to soft-failures induced by Electrostatic Discharge (ESD)-like events. This methodology uses an exclusively "black-box" approach to determine the response of an IC in a system-level environment, thereby allowing it to be implemented without intimate knowledge of the DUT IC. Results from this methodology can be referenced during system design to raise awareness of specific vulnerabilities of the core system ICs.
During work on this methodology, several sub topics have been explored and developed in the field of system-level ESD. Sections 2 and 3 introduce two topics which were developed to facilitate the generation and expression of IC pin models. Papers 1 and 2 introduce injection methods for characterizing complete systems on an interface-by-interface basis and form the foundation for the following works. Papers 2 and 3 mirror Papers 1 and 2 but instead shift focus away from the system as a whole and outline methods for characterizing the integrated circuits directly. Finally, Section 4 outlines a model method which can be used to describe the failures found in Paper 4 in circuit simulation, rounding out the work. Additional measurements which were unable to be included in Paper 4 are included in Appendices A, B, and C"--Abstract, page iv.
Advisor(s)
Pommerenke, David
Committee Member(s)
Beetner, Daryl G.
Fan, Jun, 1971-
Khilkevich, Victor
Gossner, Harald
Department(s)
Electrical and Computer Engineering
Degree Name
Ph. D. in Electrical Engineering
Publisher
Missouri University of Science and Technology
Publication Date
Fall 2016
Journal article titles appearing in thesis/dissertation
- Powered system-level conductive TLP probing method for ESD/EMI hard fail and soft fail threshold evaluation
- A systematic method for determining soft-failure robustness of a subsystem
- A passive coupling circuit for injecting TLP-like stress into only one end of a driver/receiver system
- Characterization of an application processor with respect to ESD-induced soft failures
Pagination
xvii, 210 pages
Note about bibliography
Includes bibliographic references.
Rights
© 2016 Benjamin J. Orr, All rights reserved.
Document Type
Dissertation - Open Access
File Type
text
Language
English
Subject Headings
Integrated circuits -- ProtectionElectric dischargesElectrostaticsElectronic circuits -- Noise -- DetectionElectromagnetic compatibility
Thesis Number
T 11046
Electronic OCLC #
974710282
Recommended Citation
Orr, Benjamin J., "Characterization of an Integrated Circuit with Respect to Electrostatic Discharge-Induced Soft Failures" (2016). Doctoral Dissertations. 2543.
https://scholarsmine.mst.edu/doctoral_dissertations/2543