MTComm Based Virtualization and Integration of Physical Machine Operations with Digital-Twins in Cyber-Physical Manufacturing Cloud


Digital-Twins simulate physical world objects by creating as-is virtual images in a cyberspace. In order to create a well synchronized digital-twin simulator in manufacturing, information and activities of a physical machine need to be virtualized. Many existing digital-twins stream read-only data of machine sensors and do not incorporate operations of manufacturing machines through Internet. In this paper, a new method of virtualization is proposed to integrate machining data and operations into the digital-twins using Internet scale machine tool communication method. A fully functional digital-twin is implemented in CPMC testbed using MTComm and several manufacturing application scenarios are developed to evaluate the proposed method and system. Performance analysis shows that it is capable of providing data-driven visual monitoring of a manufacturing process and performing manufacturing operations through digital twins over the Internet. Results of the experiments also shows that the MTComm based digital twins have an excellent efficiency.

Meeting Name

5th IEEE International Conference on Cyber Security and Cloud Computing (CSCloud)/4th IEEE International Conference on Edge Computing and Scalable Cloud (EdgeCom) (2018: Jun. 22-24, Shanghai, China)


Computer Science

Second Department

Mechanical and Aerospace Engineering

Research Center/Lab(s)

Intelligent Systems Center


This project is supported by NSF Grant CMMI 1551448 entitled "EAGER/Cybermanuacturing: Architecture and Protocols for Scalable Cyber-Physical Manufacturing Systems".

Keywords and Phrases

Cyber Physical System; Edge computing; Embedded systems; Machine tools; Virtual reality; Virtualization; CPMC; Digital-Twin; Manufacturing applications; Manufacturing machine; Manufacturing operations; Manufacturing process; MTComm; Physical world objects; Manufacture; Cyber Manufacturing; Cyber-Physical Systems

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2018 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jun 2018