Title

Toward Feature-Preserving 2D and 3D Vector Field Compression

Abstract

The objective of this work is to develop error-bounded lossy compression methods to preserve topological features in 2D and 3D vector fields. Specifically, we explore the preservation of critical points in piecewise linear vector fields. We define the preservation of critical points as, without any false positive, false negative, or false type change in the decompressed data, (1) keeping each critical point in its original cell and (2) retaining the type of each critical point (e.g., saddle and attracting node). The key to our method is to adapt a vertex-wise error bound for each grid point and to compress input data together with the error bound field using a modified lossy compressor. Our compression algorithm can be also embarrassingly parallelized for large data handling and in situ processing. We benchmark our method by comparing it with existing lossy compressors in terms of false positive/negative/type rates, compression ratio, and various vector field visualizations with several scientific applications.

Meeting Name

IEEE Pacific Visualization Symposium, PacificVis (2020: Jun. 3-5, Tianjin, China)

Department(s)

Computer Science

Comments

This material is based upon work supported by Laboratory Directed Research and Development (LDRD) funding from Argonne National Laboratory, provided by the Director, Office of Science, of the U.S. Department of Energy under Contract No. DE-AC02-06CH11357. This work is also supported by the U.S. Department of Energy, Office of Advanced Scientific Computing Research, Scientific Discovery through Advanced Computing (SciDAC) program.

Keywords and Phrases

Critical Points; Lossy Compression; Vector Field Visualization

International Standard Book Number (ISBN)

978-172815697-2

International Standard Serial Number (ISSN)

2165-8765; 2165-8773

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2020 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Jun 2020

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