Abstract
Precise integration of DNA origami nanostructures onto functional substrates is essential for advancing electronics, photonics, and biosensing. However, most surface-assembly methods are highly sensitive to substrate type, limiting their broader applications. Here, we introduce a thermal release tape (TRT)-assisted transfer method that enables efficient, large-area printing of DNA origami-guided gold nanoparticle (AuNP-DNA origami) arrays from mica onto diverse surfaces. The method relies on differential adhesion: AuNP-DNA origami arrays form strong electrostatic and hydrogen-bonding interactions with 3-aminopropyltriethoxysilane (APTES)-functionalized receiver substrates, while the TRT adhesive weakens upon heating to 120°C, allowing release from the tape. Using this approach, well-ordered AuNP-DNA origami arrays were transferred onto silicon, Silicon carbide, and glass coverslips. Under optimized conditions, on average, ∼70% of the prepatterned domain area on mica was successfully transferred to silicon while preserving the designed lattice geometry; non-optimized surface treatments or peeling conditions yielded lower transfer efficiencies, underscoring the need for process optimization. The TRT-assisted process is simple, scalable, and material-independent, avoiding lithographic patterning or substrate-specific self-assembly. This proof-of-concept study establishes a versatile platform for expanding substrate compatibility in DNA nanotechnology and provides a foundation for the large-scale integration of nanoscale patterns into functional devices.
Recommended Citation
Y. Zhang et al., "Scalable Transfer of DNA Origami–Directed Nanoparticle Arrays Onto Functional Surfaces using Thermal Release Tape," Particle and Particle Systems Characterization, vol. 43, no. 1, article no. e00205, Wiley, Jan 2026.
The definitive version is available at https://doi.org/10.1002/ppsc.202500205
Department(s)
Chemistry
Publication Status
Full Access
Keywords and Phrases
DNA origami; gold nanoparticle arrays; pattern transfer; self-assembly; thermal release tape
International Standard Serial Number (ISSN)
1521-4117; 0934-0866
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2026 Wiley, All rights reserved.
Publication Date
01 Jan 2026
Comments
Office of Research and Innovation, Drexel University, Grant CCF‐1814797