Dielectric Properties of Polymer-particle Nanocomposites Influenced by Electronic Nature of Filler Surfaces
Abstract
The interface between the polymer and the particle has a critical role in altering the properties of a composite dielectric. Polymer-ceramic nanocomposites are promising dielectric materials for many electronic and power devices, combining the high dielectric constant of ceramic particles with the high dielectric breakdown strength of a polymer. Self-assembled monolayers of electron rich or electron poor organophosphate coupling groups were applied to affect the filler-polymer interface and investigate the role of this interface on composite behavior. The interface has potential to influence dielectric properties, in particular the leakage and breakdown resistance. The composite films synthesized from the modified filler particles dispersed into an epoxy polymer matrix were analyzed by dielectric spectroscopy, breakdown strength, and leakage current measurements. The data indicate that significant reduction in leakage currents and dielectric losses and improvement in dielectric breakdown strengths resulted when electropositive phenyl, electron-withdrawing functional groups were located at the polymer-particle interface. At a 30 vol % particle concentration, dielectric composite films yielded a maximum energy density of ∼8 J·cm-3 for TiO2-epoxy nanocomposites and ∼9.5 J·cm-3 for BaTiO3-epoxy nanocomposites. © 2013 American Chemical Society.
Recommended Citation
S. Siddabattuni et al., "Dielectric Properties of Polymer-particle Nanocomposites Influenced by Electronic Nature of Filler Surfaces," ACS Applied Materials and Interfaces, American Chemical Society (ACS), Jan 2013.
The definitive version is available at https://doi.org/10.1021/am3030239
Department(s)
Chemistry
Second Department
Materials Science and Engineering
International Standard Serial Number (ISSN)
1944-8244
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2013 American Chemical Society (ACS), All rights reserved.
Publication Date
01 Jan 2013