Microstrip structures, formed by metal traces printed on a dielectric substrate above a reference plane, are frequently the object of electromagnetic modeling. In this paper, hybrid FEM/MoM formulations employing conventional Whitney elements and newly developed linear-tangent/linear-normal (LT/LN) tangential vector finite elements (TVFEs) are applied to the analysis of microstrip structures with thin traces. This paper shows that the variation of the electric field below the trace is a significant issue to be addressed in microstrip structure modeling. Different mesh methods are investigated and the advantages of the LT/LN TVFEs are discussed.
H. Wang et al., "Application of Higher-Order FEM Elements to the Analysis of Microstrip Structures," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2002, Minneapolis, MN), vol. 2, pp. 1015-1019, Institute of Electrical and Electronics Engineers (IEEE), Aug 2002.
The definitive version is available at https://doi.org/10.1109/ISEMC.2002.1032835
IEEE International Symposium on Electromagnetic Compatibility (2002: Aug. 19-23, Minneapolis, MN)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Whitney Elements; Dielectric Substrate; Electromagnetic Modeling; Finite Element Analysis; Higher-Order FEM Elements; Linear-Tangent/Linear-Normal Tangential Vector Finite Elements; Mesh Methods; Method Of Moments; Microstrip Lines; Microstrip Structures Analysis; Substrates; Boundary Conditions; Dielectric Materials; Electric Field Effects; Finite Difference Method; Finite Element Method; Mathematical Models; Printed Circuit Boards; Time Domain Analysis; Microstrip Structures; Microstrip Devices
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2002 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.