Title

New De-Embedding Techniques for PCB Transmission-Line Characterization

Abstract

Commercially available transmission-line characterization techniques within the PCB industry often face challenges in de-embedding of launching vias, where a long via or via stub can significantly impact the results at high frequencies. In this paper, VNA measurements with various de-embedding methods, including those that utilize only one "2X-thru" calibration standard are studied. Commercial tools and a new method with an alternative algorithm are used to remove the test fixture and via from the measurement. Test boards were built with varying lengths of transmission lines, and in different routing layers. Excellent de-embedded results are achieved up to 30 GHz. The "2X-thru" de-embedding methodology significantly simplified the test-fixture design, and the de-embedding procedures.

Meeting Name

DesignCon 2015 (2015: Jan. 27-30, Santa Clara, CA)

Department(s)

Electrical and Computer Engineering

Research Center/Lab(s)

Center for High Performance Computing Research

Keywords and Phrases

Fixtures (tooling); Printed circuit boards; Alternative algorithms; Calibration standard; Characterization techniques; Commercial tools; De-embedding method; De-embedding techniques; High frequency HF; Routing layers; Electric lines

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2015 UBM Electronics, All rights reserved.

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