New De-Embedding Techniques for PCB Transmission-Line Characterization
Commercially available transmission-line characterization techniques within the PCB industry often face challenges in de-embedding of launching vias, where a long via or via stub can significantly impact the results at high frequencies. In this paper, VNA measurements with various de-embedding methods, including those that utilize only one "2X-thru" calibration standard are studied. Commercial tools and a new method with an alternative algorithm are used to remove the test fixture and via from the measurement. Test boards were built with varying lengths of transmission lines, and in different routing layers. Excellent de-embedded results are achieved up to 30 GHz. The "2X-thru" de-embedding methodology significantly simplified the test-fixture design, and the de-embedding procedures.
X. Ye et al., "New De-Embedding Techniques for PCB Transmission-Line Characterization," Proceedings of the DesignCon 2015 (2015, Santa Clara, CA), UBM Electronics, Jan 2015.
DesignCon 2015 (2015: Jan. 27-30, Santa Clara, CA)
Electrical and Computer Engineering
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Fixtures (tooling); Printed circuit boards; Alternative algorithms; Calibration standard; Characterization techniques; Commercial tools; De-embedding method; De-embedding techniques; High frequency HF; Routing layers; Electric lines
Article - Conference proceedings
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