Title

PCB Ground Fill Design Guidelines for Radiated EMI

Abstract

This paper is to alert PCB designers about potential EMI problems caused by ground fills in outer layers of PCB. Ground fills are frequently used on top and bottom layers of PCBs for manufacturing or perceived shielding reasons. However, if not well applied they may cause EMI problem, especially if they form resonators. Several types of situations need to be distinguished, by (1) the resonating structure and (2) the excitation structure. Examples of problematic structures are shown by simulation and measurement. Possible guidelines for mitigating such problems are discussed.

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

EMI; PCB; Design Guideline; Ground Fill; Printed Circuit Board

Library of Congress Subject Headings

Printed circuits

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2008 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.


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