Title

Coupling Paths in Multilayer Printed Circuit Boards for Electromagnetic Interference and Immunity: Experiments and FDTD Modeling

Abstract

Electromagnetic emissions from electronics associated with explosives is a potential detection modality, both passive listening, and stimulated RF emissions. However, the parasitic paths by which energy is coupled off a printed circuit board from an active device, and by which external energy can be coupled onto the board and to a device, must be identified and characterized. One such noise-coupling path is identified in this work, and a modeling approach demonstrated. In particular, coupling of noise from the DC power bus of a multilayer printed circuit board that uses entire metal layers for power and ground, and an I/O line that transitions through the DC power planes is investigated.

Meeting Name

Detection and Remediation Technologies for Mines and Minelike Targets VI (2001: Apr. 16-20, Orlando, FL)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

Explosives; Multilayers; Natural Frequencies; Printed Circuit Boards; Spurious Signal Noise; Noise-Coupling Path; Signal Interference

International Standard Serial Number (ISSN)

0277-786X

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2001 SPIE -- The International Society for Optical Engineering, All rights reserved.

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