Title

Coupling Paths in Multilayer Printed Circuit Boards for Electromagnetic Interference and Immunity: Experiments and FDTD Modeling

Abstract

Electromagnetic emissions from electronics associated with explosives is a potential detection modality, both passive listening, and stimulated RF emissions. However, the parasitic paths by which energy is coupled off a printed circuit board from an active device, and by which external energy can be coupled onto the board and to a device, must be identified and characterized. One such noise-coupling path is identified in this work, and a modeling approach demonstrated. In particular, coupling of noise from the DC power bus of a multilayer printed circuit board that uses entire metal layers for power and ground, and an I/O line that transitions through the DC power planes is investigated.

Department(s)

Electrical and Computer Engineering

Second Department

Materials Science and Engineering

Keywords and Phrases

Electromagnetic Emissions

Library of Congress Subject Headings

Electronics
Explosives

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2001 SPIE -- The International Society for Optical Engineering, All rights reserved.


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