Coupling Paths in Multilayer Printed Circuit Boards for Electromagnetic Interference and Immunity: Experiments and FDTD Modeling
Electromagnetic emissions from electronics associated with explosives is a potential detection modality, both passive listening, and stimulated RF emissions. However, the parasitic paths by which energy is coupled off a printed circuit board from an active device, and by which external energy can be coupled onto the board and to a device, must be identified and characterized. One such noise-coupling path is identified in this work, and a modeling approach demonstrated. In particular, coupling of noise from the DC power bus of a multilayer printed circuit board that uses entire metal layers for power and ground, and an I/O line that transitions through the DC power planes is investigated.
W. Cui et al., "Coupling Paths in Multilayer Printed Circuit Boards for Electromagnetic Interference and Immunity: Experiments and FDTD Modeling," Proceedings of SPIE, SPIE -- The International Society for Optical Engineering, Apr 2001.
The definitive version is available at http://dx.doi.org/10.1117/12.445464
Electrical and Computer Engineering
Materials Science and Engineering
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Article - Conference proceedings
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