Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board
A methodology for modeling the power delivery network from the voltage regulator module to the pins of a high pin count integrated circuit on a printed circuit board (PCB) is presented. The proposed model is based on inductance extraction from first principle formulation of a cavity formed by parallel metal planes. Circuit reduction is used to practically realize the model for a production level, complex, multilayer PCBs. The lumped element model is compatible with SPICE-type simulators. The resulting model has a relatively simple circuit topology. The model is corroborated with microprobing measurements up to a few gigahertz. The model can be used for a wide range of geometry variations in a power integrity analysis, including complex power/ground stack up, various numbers of decoupling capacitors with arbitrary locations, numerous IC power pins and IC power/ground return via layouts, as well as hundreds of ground return vias.
K. Shringarpure et al., "Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production-Level Multilayered Printed Circuit Board," IEEE Transactions on Electromagnetic Compatibility, vol. 58, no. 3, pp. 849-858, Institute of Electrical and Electronics Engineers (IEEE), Jun 2016.
The definitive version is available at http://dx.doi.org/10.1109/TEMC.2016.2535459
Electrical and Computer Engineering
Center for High Performance Computing Research
Second Research Center/Lab
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
Complex networks; Electric network analysis; Electric power transmission; Printed circuits; Reconfigurable hardware; Topology; Voltage regulators; Decoupling capacitor; Inductance extraction; Lumped element model; Multi-layered printed circuit boards; Power delivery network; Power distribution network; Printed circuit boards (PCB); Voltage regulator module; Printed circuit boards; Modeling PCB PDN; power integrity
International Standard Serial Number (ISSN)
Article - Journal
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