The paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation.
G. Selli et al., "Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, 2004, Institute of Electrical and Electronics Engineers (IEEE), Jan 2004.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2004.1349862
IEEE International Symposium on Electromagnetic Compatibility, 2004
Electrical and Computer Engineering
Keywords and Phrases
PCB; SPICE; SPICE Via Model; Circuit Simulation; Differential Signaling; Digital Circuit System Designs; Full-Wave Modeling; High-Speed Digital Designs; Printed Circuit Boards; Printed Circuit Design; Signal Integrity; Via Transitions
Article - Conference proceedings
© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.