This paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation.
S. Luan and G. Selli and J. L. Drewniak and A. de Luca and G. Antonini and A. Orlandi and A. C. Scogna and J. Fan and J. L. Knighten and N. W. Smith and R. Alexander, "Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling," Proceedings of the IEEE International Symposium on Electromagnetic Compatibility (2004, Santa Clara, CA), vol. 2, pp. 577-582, Institute of Electrical and Electronics Engineers (IEEE), Aug 2004.
The definitive version is available at https://doi.org/10.1109/ISEMC.2004.1349862
IEEE International Symposium on Electromagnetic Compatibility (2004: Aug. 9-13, Santa Clara, CA)
Electrical and Computer Engineering
Electromagnetic Compatibility (EMC) Laboratory
Keywords and Phrases
PCB; SPICE; SPICE Via Model; Circuit Simulation; Differential Signaling; Digital Circuit System Designs; Full-Wave Modeling; High-Speed Digital Designs; Printed Circuit Boards; Printed Circuit Design; Signal Integrity; Via Transitions; Via Transition; Bit Error Rate; Capacitance; Data Transfer; Dielectric Materials; Inductance; Interfaces (Computer); Signal Processing
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Article - Conference proceedings
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