Abstract

The paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation.

Meeting Name

IEEE International Symposium on Electromagnetic Compatibility, 2004

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

PCB; SPICE; SPICE Via Model; Circuit Simulation; Differential Signaling; Digital Circuit System Designs; Full-Wave Modeling; High-Speed Digital Designs; Printed Circuit Boards; Printed Circuit Design; Signal Integrity; Via Transitions

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2004 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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