Knowledge of high-frequency currents in the chip and chip-package are necessary for EMI analysis and prediction, though measurement of these currents may be difficult to obtain in many cases. One possibility is to estimate currents from near-field scan data. In this paper, measurements were made of the magnetic field over a simple circuit and a chip package. The current flowing in the circuit and the chip lead frame was estimated from the compensated near-field data and compared with measurements made directly on the pins. Estimation was performed both with and without structural information of the lead frame. The susceptibility of estimated currents to measurement errors was analyzed. Results show this technique can be a powerful tool for analyzing high frequency chip currents.
H. Weng et al., "Estimation of Current from Near-Field Measurement," Proceedings of the 2005 International Symposium on Electromagnetic Compatibility (2005, Chicago, IL), Institute of Electrical and Electronics Engineers (IEEE), Aug 2005.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2005.1513504
2005 International Symposium on Electromagnetic Compatibility, EMC 2005 (2005: Aug. 8-12, Chicago, IL)
Electrical and Computer Engineering
Keywords and Phrases
EMI Analysis; Chip Package; Chip Scale Packaging; Circuit Package; Current Estimation; Electric Current; Electromagnetic Interference; High Frequency Chip Currents; Magnetic Fields; Microprocessor Chips; Near-Field Measurement; Structural Information
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.