Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Near-field magnetic scanning is an effective tool for measuring the current distribution in IC packages and investigating chiplevel EMI problems. This paper discusses analysis of near-magnetic field scan data using tangential and normal field measurements. Results show that combining near-field scan results from probes with multiple orientations is an effective way to identify the current paths in IC packages. Ã‚Â© 2005 IEEE.
X. Dong et al., "Determination of High Frequency Package Currents from Near-Field Scan Data," Proceedings of the 2005 International Symposium on Electromagnetic Compatibility (2005, Chicago, IL), vol. 3, pp. 679-683, Institute of Electrical and Electronics Engineers (IEEE), Aug 2005.
The definitive version is available at http://dx.doi.org/10.1109/ISEMC.2005.1513610
2005 International Symposium on Electromagnetic Compatibility, EMC 2005 (2005: Aug. 8-12, Chicago, IL)
Electrical and Computer Engineering
Keywords and Phrases
EMI; IC; Near-field Magnetic Scanning; VLSI
International Standard Book Number (ISBN)
International Standard Serial Number (ISSN)
Article - Conference proceedings
© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.