Abstract

Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Near-field magnetic scanning is an effective tool for measuring the current distribution in IC packages and investigating chiplevel EMI problems. This paper discusses analysis of near-magnetic field scan data using tangential and normal field measurements. Results show that combining near-field scan results from probes with multiple orientations is an effective way to identify the current paths in IC packages.

Meeting Name

2005 International Symposium on Electromagnetic Compatibility, EMC 2005 (2005: Aug. 8-12, Chicago, IL)

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

EMI; IC; Near-field Magnetic Scanning; VLSI

International Standard Book Number (ISBN)

0-7803-9380-5

International Standard Serial Number (ISSN)

2158-110X

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2005 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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