Abstract

The effectiveness of DC power bus decoupling is impacted by the inductance associated with interconnect vias in printed circuit boards (PCBs). Adequate characterization of these interconnects is necessary to facilitate modeling and simulation, and to assess the effectiveness of added decoupling. A measurement procedure is presented for determining the series inductance and resistance of an interconnect with a network analyzer. The validity and limitations of the procedure are discussed. Experimental results of interconnect parameters on an 8 x 10 in ten-layer test-board corroborate those measured with a precision impedance analyzer. The measured interconnect values are used to simulate several cases of power-bus decoupling which show good agreement with two-port swept frequency measurements

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

DC Power Bus Decoupling; EMI; PCB; Circuit Analysis Computing; Electric Resistance Measurement; Electromagnetic Interference; Experimental Procedure; Experimental Results; Inductance; Interconnect Parameters; Interconnect Vias; Measurement Procedure; Multilayer Printed Circuit Board; Network Analyzer; Precision Impedance Analyzer; Printed Circuit Testing; Series Inductance; Series Resistance; Two-Port Swept Frequency Measurements

International Standard Serial Number (ISSN)

0018-9375

Document Type

Article - Journal

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 1997 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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