Signal transitioning through layers on vias are very common in multi-layer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current must switch from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in noise on the power bus that can lead to signal integrity, as well as EMI problems. Numerical methods, such as the finite-difference time-domain (FDTD), Moment of Methods (MoM), and partial element equivalent circuit (PEEC) method, were employed herein to study this problem. The modeled results are supported by measurements. In addition, a common EMI mitigation approach of adding a decoupling capacitor was investigated with the FDTD method.
W. Cui et al., "Modeling EMI Resulting from a Signal Via Transition Through Power/Ground Layers," Proceedings of the 16th Annual Review of Progress in Applied Computational Electromagnetics, Defense Technical Information Center (DTIC), Jan 2000.
16th Annual Review of Progress in Applied Computational Electromagnetics
Electrical and Computer Engineering
Keywords and Phrases
Internal Power; Layers; Printed Circuit Board Design; Signal Transitioning
Article - Conference proceedings
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