Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current has to jump from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in power bus noise, and can produce an EMI problem as well. Numerical methods, such as finite-difference time-domain (FDTD), moment methods (MoM), and partial element equivalent circuit (PEEC), were employed herein to study this problem. The modeled results were supported by the measurements. In addition, the EMI mitigation approach of adding decoupling capacitors was investigated with the FDTD method
W. Cui et al., "EMI Resulting from a Signal Via Transition Through DC Power Bus-Effectiveness of Focal SMT Decoupling," Proceedings of the Asia-Pacific Conference on Environmental Electromagnetics, 2000. CEEM 2000, Institute of Electrical and Electronics Engineers (IEEE), Jan 2000.
The definitive version is available at http://dx.doi.org/10.1109/CEEM.2000.853908
Asia-Pacific Conference on Environmental Electromagnetics, 2000. CEEM 2000
Electrical and Computer Engineering
Keywords and Phrases
DC Power Bus; EMI; Electromagnetic Interference; Equivalent Circuits; Finite Difference Time-Domain Analysis; Finite-Difference Time-Domain Method; Focal SMT Decoupling; Method of Moments; Moment Method; Multilayer Printed Circuit Board Design; Partial Element Equivalent Circuit; Printed Circuits; Reference Plane; Surface Mount Technology
Article - Conference proceedings
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