Abstract

Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current has to jump from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in power bus noise, and can produce an EMI problem as well. Numerical methods, such as finite-difference time-domain (FDTD), moment methods (MoM), and partial element equivalent circuit (PEEC), were employed herein to study this problem. The modeled results were supported by the measurements. In addition, the EMI mitigation approach of adding decoupling capacitors was investigated with the FDTD method

Meeting Name

Asia-Pacific Conference on Environmental Electromagnetics, 2000. CEEM 2000

Department(s)

Electrical and Computer Engineering

Keywords and Phrases

DC Power Bus; EMI; Electromagnetic Interference; Equivalent Circuits; Finite Difference Time-Domain Analysis; Finite-Difference Time-Domain Method; Focal SMT Decoupling; Method of Moments; Moment Method; Multilayer Printed Circuit Board Design; Partial Element Equivalent Circuit; Printed Circuits; Reference Plane; Surface Mount Technology

Document Type

Article - Conference proceedings

Document Version

Final Version

File Type

text

Language(s)

English

Rights

© 2000 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

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