Abstract
Adhesion and residual stress play a critical role in the performance and reliability of microdevices, in particular, the cross bridge of RF microswitches. to investigate their combinatorial influences on thin films, an elastic model is constructed for a clamped circular membrane in contact with the planar surface of a rigid cylindrical punch. External force applied to the punch leads to thin film delamination and ultimately 'pull-off' at a critical non-zero contact radius. Characteristic trends of the mechanical responses were obtained for fixed load and fixed grips in terms of pull-off force, punch displacement and contact radius. It is shown that when the residual stress falls below a critical threshold that is related to the elastic properties and dimensions of the film, its effect becomes negligible. Simple pull-off methods are suggested to measure the residual stress and adhesion energy. the obtained results have significant implications to various microelectromechanical systems that include contacting surfaces. © 2005 IOP Publishing Ltd.
Recommended Citation
K. T. Wan and L. Kogut, "The Coupling Effect of Interfacial Adhesion and Tensile Residual Stress on a Thin Membrane Adhered to a Flat Punch," Journal of Micromechanics and Microengineering, vol. 15, no. 4, pp. 778 - 784, IOP Publishing, Apr 2005.
The definitive version is available at https://doi.org/10.1088/0960-1317/15/4/015
Department(s)
Mechanical and Aerospace Engineering
International Standard Serial Number (ISSN)
0960-1317
Document Type
Article - Journal
Document Version
Citation
File Type
text
Language(s)
English
Rights
© 2024 IOP Publishing, All rights reserved.
Publication Date
01 Apr 2005
