Force Modeling of Silicon Monocrystal Wire Saw Machining

Abstract

Wire saw machining is often used to cut hard and brittle materials, especially wafers in the semiconductor and optoelectronics industries. The cutting forces strongly effect part quality. Based on analyzing the forces generated from the chip deformation and friction of a single abrasive, an analytical force model is developed. The model is extended to a wire saw cutting force model and is used to explain the relationship between the cutting force and the part feed rate, wire velocity, and contact length between the wire and part. Silicon (Si) monocrystal machining is used to experimentally validate the proposed model. The results show that when machining Si monocrystal the average errors between the experimental and predicted normal and tangential cutting forces are 10.9% and 18.6%, respectively.

Meeting Name

2016 International Symposium on Flexible Automation, ISFA2016 (2016: Aug. 1-3, Cleveland, OH)

Department(s)

Mechanical and Aerospace Engineering

Comments

The authors wish to acknowledge the financial support for this work from the National Natural Science Foundation of China (51175420, 51575442), the Shaanxi Province Education Department (00S1409), and the Intelligent Systems Center at the Missouri University of Science and Technology.

Keywords and Phrases

Cutting; Monocrystalline silicon; Sawing; Silicon wafers; Wire; Average errors; Chip deformations; Contact length; Cutting forces; Hard and brittle materials; Optoelectronics industry; Tangential cutting force; Wire velocity; Saws

International Standard Book Number (ISBN)

978-1-5090-3467-3

Document Type

Article - Conference proceedings

Document Version

Citation

File Type

text

Language(s)

English

Rights

© 2016 Institute of Electrical and Electronics Engineers (IEEE), All rights reserved.

Publication Date

01 Aug 2016

Link to Full Text

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