Femtosecond Laser-Induced Silicon Surface Morphology in Water
This article investigates the use of femtosecond laser induced surface morphology on silicon wafer surface in water confinement. Unlike irradiation of silicon surfaces in the air, there are no laser induced periodic structures, but irregular roughness is formed when the silicon wafer is ablated under water. The unique discovery of a smoothly processed silicon surface in water confinement under certain laser parameter combinations may help improve laser direct micromachining surface quality in industrial applications. Copyright © 2008 by ASME.
Y. Han et al., "Femtosecond Laser-Induced Silicon Surface Morphology in Water," ASME International Mechanical Engineering Congress and Exposition, Proceedings, American Society of Mechanical Engineers (ASME), Jan 2009.
The definitive version is available at https://doi.org/10.1115/IMECE2008-67923
2008 ASME International Mechanical Engineering Congress and Exposition, IMECE 2008
Mechanical and Aerospace Engineering
Article - Conference proceedings
© 2009 American Society of Mechanical Engineers (ASME), All rights reserved.
01 Jan 2009