Effect of Dielectric Selection on Sintering Behavior of LTCC


Low Temperature Cofired Ceramic (LTCC) is a versatile ceramic packaging technology. LTCC's functionality and performance can be enhanced with the incorporation of passive devices such as resistors, capacitors, and inductors into the structure of the substrate. This incorporation, which eliminates surface mount solder joints is desirable for improving system reliability and allows for increased package density. Commercially available dielectrics for embedding capacitors into LTCC are limited and the incorporation of such systems into LTCC substrates poses processing challenges related to material compatibility. This paper will review multiple dielectric systems and techniques for embedding capacitors into LTCC as well as present new data related to the cofiring behavior of LTCC and custom dielectrics.

Meeting Name

43rd Annual IMAPS International Symposium on Microelectronics (2010: Oct. 31-Nov. 4, Raleigh, NC)


Materials Science and Engineering

Keywords and Phrases

Barium titanate; Buried capacitors; Buried passives; DuPont 951™ LTCC; Ceramic packaging; Dielectric systems; Improving systems; Low-temperature co-fired ceramics; Material compatibility; Sintering behaviors

International Standard Book Number (ISBN)


Document Type

Article - Conference proceedings

Document Version


File Type





© 2010 International Microelectronics Assembly and Packaging Society, All rights reserved.

Publication Date

01 Oct 2010