Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests
In the current study, solder joint integrity was investigated using high speed shear and pull tests on a newly developed bond tester. Solder ball attachment strengths and failure modes were recorded together with fracture energies. Lead-free and lead-tin solders were compared on various pad finishes. Fracture surfaces were examined to assess failure modes and fracture location. More brittle fractures were observed with increasing speed in all types of packages and in both test configurations, but differences between solder types were clear. Correlations between failure mode, strength and energy are discussed. The effect of shear tool height on high speed shear test results is also discussed.
F. Song et al., "Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests," Proceedings of the 16th European Microelectronics & Packaging Conference, Elsevier, Jan 2007.
Mathematics and Statistics
Keywords and Phrases
Ball pull; failure mode; fracture energy; high speed ball shear
Article - Conference proceedings
© 2007 Elsevier, All rights reserved.
01 Jan 2007