Masters Theses

Author

Feng Zhang

Abstract

"The glass weave structure of a manufactured Printed Circuit Board (PCB) is scanned under a Scanning Electron Microscope (SEM), with top-down and cross-sectional views. Previously, analytical methods were used to investigate the glass-weave effect on transition properties in a PCB. Based on the SEM observation, this study was conducted to build full-wave models using various glass-weave types and different relative positions between differential traces and glass-weave bundles. This study aims to obtain the relationship between the glass weave and trace geometry, and the phase skew of the differential trace by using Design of Experiment (DoE) method and simulation results"--Abstract, page iii.

Advisor(s)

Fan, Jun, 1971-

Committee Member(s)

Khilkevich, Victor
Tsiklauri, Mikheil

Department(s)

Electrical and Computer Engineering

Degree Name

M.S. in Electrical Engineering

Publisher

Missouri University of Science and Technology

Publication Date

Spring 2019

Pagination

xii, 53 pages

Note about bibliography

Includes bibliographic references (pages 51-52).

Rights

© 2019 Feng Zhang, All rights reserved.

Document Type

Thesis - Open Access

File Type

text

Language

English

Thesis Number

T 11563

Electronic OCLC #

1105154641

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