Masters Theses


Pengyu Wei

Keywords and Phrases

ESD; High speed; SEED; Transient behavior; TVS; USB3


"This research proposal presents a methodology whereby a protection device can be modeled in SPICE compatible platforms with respect to the transient behaviors during Electrostatic Discharge (ESD) events. This methodology uses an exclusively "black-box" approach to characterize the parameters of the protection device, thereby allowing it to be implemented without intimate knowledge of the DUT. Results of this methodology can be used to predict the transient response (conductivity modulation and snapback delay) of the ESD protection devices, and thereby predicts how much current could flow into the device (typically a digital IO pin) under protection. The transient behavior modeling methodology for the ESD protection device is developed for the purpose of system level ESD design, and it is part of the study of System-level Effective ESD Design (SEED) methodology. During the work, the transient behavior modeling method and the SEED methodology have been applied to a high-speed USB3.x repeater IC circuit design. This article introduces a PCB test board working as USB3.x repeater, which allows to place various on-board protection devices and to measure the residual voltage and current at the IO pin accurately.

In Section 2, the transient behavior modeling framework and the characterization method will be introduced. The validation results of three different types of protection devices are shown in the end of the section. In Section 3, the implementation of SEED methodology to a USB3.x system design will be introduced. The measurement setup is described in detail. Finally, the validation results for different scenarios will be shown"--Abstract, page iii.


Pommerenke, David

Committee Member(s)

Fan, Jun, 1971-
Khilkevich, Victor


Electrical and Computer Engineering

Degree Name

M.S. in Electrical Engineering


Missouri University of Science and Technology

Publication Date

Fall 2018


xi, 75 pages

Note about bibliography

Includes bibliographical references (pages 72-74).


© 2018 Pengyu Wei, All rights reserved.

Document Type

Thesis - Open Access

File Type




Thesis Number

T 11450

Electronic OCLC #