Masters Theses


Anup Arjun

Keywords and Phrases

Delamination; Strain energy release rate


"The mechanical integrity of thin films is characterized by the adhesion between solid bodies and membranes. Two methods to evaluate the strain energy release rates of thin film delamination are discussed. This strain energy release rate is useful to the experimentalists in their measurements of adhesion or delamination energy of thin films having wide ranging thickness and stiffness.

This thesis is primarily concerned with the pressurized blister test and a novel circular punch loaded technique. The adhesive contact mechanics in these two cases is formulated here. The thesis is categorized into four sections. The first section delineates the background and the literature review of thin film adhesion. The second section highlights a new method in deriving the strain energy release rate, G, in case of a pressurized circular blister. The third section is a study of the delamination of a thin flexible membrane from an axisymmetric flat punch under the presence of surface forces. Here, only the case of a pure stretching membrane is considered for simplicity and thereby, the plate bending is assumed negligible. In both cases zero residual stress is assumed to be present in the thin film. Finally, the fourth section summarizes all the first three sections and suggests some future extensions of the present work narrated in this thesis."--Abstract, page iii.


Wan, Kai-tak

Committee Member(s)

Dharani, Lokeswarappa R.
Wilkerson, Ralph W.


Mechanical and Aerospace Engineering

Degree Name

M.S. in Mechanical Engineering


University of Missouri--Rolla

Publication Date

Fall 2004


ix, 63 pages

Note about bibliography

Includes bibliographical references (pages 58-62).


© 2004 Anup Arjun, All rights reserved.

Document Type

Thesis - Restricted Access

File Type




Subject Headings

Thin films -- Analysis

Thesis Number

T 8662

Print OCLC #


Link to Catalog Record

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